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ASAT EDQUAD Plastic Quad Flatpack Reliability Assessment Report
RELIABILITY REPORT 97-05, Jeff Kessenich, August 1997, 6 pages.

This report summarizes reliability assessment test results obtained on the EDQUAD plastic quad flatpack surface mount package manufactured at ASAT Ltd. in Hong Kong. The 100 lead TQ8105 and TQ8106 devices were used as test vehicles. This report is comprised of data from various JEDEC standard tests including Wire Pull, Ball Sheer, Physical Dimensions, Mark Permanency, Solderability, and Lead Integrity. Additional reliability data from ASAT is also included. QEDA2.

MSOP Package Reliability Qualification Report
RELIABILITY REPORT 97-03, Tony Rubalcava, July 1997, 7 pages.

This report summarizes package qualification test results obtained on an 8 pin MSOP package. The MSOP plastic package is manufactured by supplier H. The TQ9121 was used as the qualification test vehicle. A TQ9121 is a Low Noise Amplifier that operates with a single power supply. Tests performed were Physical Dimensions, Marking Permanency, Solderability, Autoclave, Unbiased Lifetest, Biased Humidity Lifetesting, HAST, Lead Integrity, Thermal Shock and Temperature Cycle.

SSOP24 Plastic Package Reliability Qualification Report
RELIABILITY REPORT 94-03, Tony Rubalcava, October 1994, 8 pages.

This report summarizes qualification test results obtained on an ASIC encapsulated in a SSOP24 plastic package. Testing has been performed as defined in JEDEC Standard No. 26-A, and includes HAST, Thermal Shock, Temperature Cycling, 85ºC/85% Relative Humidity, and Lifetesting.

20 Lead Plastic Package Reliability Qualification Report (request a copy)
RELIABILITY REPORT 92-02, Tony Rubalcava, December 1992, 6 pages.

This report summarizes qualification test results obtained on TriQuint's custom quad 20 lead plastic encapsulated package. The testing has been performed in accordance with test methods from JEDEC STANDARD-26-A (General Specifications for Plastic Encapsulated Microcircuits for Use in Rugged Applications).

MMIC Ceramic Package Reliability Testing Report (request a copy)
RELIABILITY REPORT 91-01, Bharati Ingle, October 1991, 10 pages.

This publication summarizes qualification test results obtained on the TriQuint multi-layered ceramic (Micro-S) package. The testing has been performed in accordance with MIL-STD-883, Method 5005, Group D.

MLC44 Package Reliability Testing Report (request a copy)
RELIABILITY REPORT 89-01, Bill Roesch, January 1989, 10 pages.

This publication summarizes qualification test results obtained on the TriQuint multi-layered ceramic package. The testing was performed in accordance with MIL-STD-883, Method 5005, Group D.