Process Publications
Reliability Evaluation of 100mm HBT Process
RELIABILITY REPORT 02-06. Dee Byrd. March 13, 2002, 10 pages.
TriQuint’s InGaP HBT process is a Gallium Arsenide (GaAs) semiconductor process fabricated at TriQuint’s Oregon
facility. The process uses epitaxial layers grown on GaAs wafers to support Heterojunction Bipolar Transistor
(HBT) active devices. The HBT process includes Nichrome (NiCr) resistors, silicon nitride MIM capacitors, 2
levels of global interconnect, and substrate via holes. 4" 100mm Wafers, B33.
Qualification of the 150mm TQRLC Process (Lead Product)
RELIABILITY REPORT 02-03. Dee Byrd, February 25, 2002, 8 pages.
This report summarizes the reliability testing that has been completed to qualify TriQuint's 150MM TQRLC passive
process. The wafer level testing was completed using a specially designed PCM for the process. The product
level testing was completed using the TQ1303 Passive Power Divider. B39, 2x2 MLF, 6", 150mm.
B31 (TQTRp) Element Qualification Report
Process Engineering Report, Andrew Ping, February 14, 2002, 32 pages.
This report summarizes element qualification test results obtained on TriQuint’s B31 process. A comprehensive
series of testing was performed on wafer in order to verify successful reliability of the process for the
Process Engineering Release Milestone.
Qualification of the 150mm QEDA2 Process
RELIABILITY REPORT 02-01. Dee Byrd, February 5, 2002, 8 pages.
This report summarizes the reliability tests that were completed to qualify TriQuint Semiconductor's conversion
of its QEDA2 0.6um E/D MesFET GaAs wafer fabrication process from 100mm wafers to 150mm wafers using the
TQ8032. (6 inch) (B37).
B39 (TQRLC) Element Qualification Report
Process Engineering Report, Andrew Ping, January 11, 2002, 40 pages.
This report summarizes element qualification test results obtained on TriQuint’s TQRLC process fabricated at
FAB3 in Hillsboro, OR. A comprehensive series of testing was performed on wafer in order to verify successful
reliability of the process. 150mm, 6" Passives.
Qualification of the TQHiF Process
RELIABILITY REPORT 01-13. Dee Byrd, November 13, 2001, 10 pages.
This report summarizes the reliability testing completed to qualify the TQHiF (B21) process on 4 inch (100mm)
Wafers. The test vehicles were the TQ8726 Demultiplexer and the TQ8218 Laser Driver. Both Products were
tested in a TSSOP-28 package from previously qualified subcontractor A1. TriQuint's TQHiF is an advanced
Gallium Arsenide (GaAs) 0.3 micron enhancement/depletion mode MesFET process.
Qualification of the 150mm Process
RELIABILITY REPORT 01-14. Dee Byrd, October 5, 2001, 8 pages.
This report summarizes the reliability tests that were completed to qualify TriQuint Semiconductor's
conversion of its E/D MesFET GaAs wafer fabrication process from 100mm wafers to 150mm wafers. TQTRx, 6".
B24 Process Qualification (SC3918 & TQ9222)
RELIABILITY REPORT 01-04. Dee Byrd, April 10, 2001, 8 pages.
This report summarizes the reliability testing that was completed to qualify the new process TQTRx (B24).
The products used to qualify this new process consisted of one (1) lot of SC-3918 and two (2) lots of
TQ-9222 products fabricated by TriQuint.
Preliminary Qualification of 150mm Process using 100mm Wafers
RELIABILITY REPORT 00-12. Dee Byrd, December 15, 2000, 7 pages.
This report summarizes the preliminary reliability test results that has been completed to qualify
TriQuint Semiconductor's conversion of its E/D MesFET GaAs wafer fabrication process from 100mm wafers
to 150mm wafers. The initial qualification was performed on products produced on 100mm wafers using the
proposed 150mm process. TQTRx.
TQTRx Process Qualification
RELIABILITY REPORT 00-09. Dee Byrd, August 25, 2000, 9 pages.
The qualification vehicle was a MesFET Power Amplifier fabricated on TriQuint's E/D MesFET GaAs process
and packaged in a QSOP16 package with a heat slug. Assembly and encapsulation of the test samples were
accomplished at supplier A. QEDA2.
SIGMA Metallization System Qualification Report
RELIABILITY REPORT 99-07. Dee Byrd, November 15, 1999, 5 pages.
This report summarizes the reliability testing that has been completed to qualify the Sigma metallization system
for use in TriQuint wafer fabrication. A down-converter product was used as the test vehicle . This test also
qualified the QSOP-16 package.
G7 Process Monitor Report - Q2 1998
RELIABILITY REPORT 98-09, Susan Bumgarner & Lita O. Monaghan, July 1998, 15 pages.
This work establishes a standardized program for ongoing monitoring of process reliability. Reliability
testing was previously done in order to qualify processes in the new Fab 3 facility in Hillsboro, Oregon
to provide an initial baseline on which to build the monitor program. The monitor repeats these previous
tests. In addition, biased lifetests of capacitors and interconnect were added. Wafer level experiments
were performed on individual devices (FETs) to determine lifetimes, and additional experiments were
performed on packaged parts in an attempt to verify the wafer level results. QEDA2.
G16 High Power Device Qualification Report for Fab 3
RELIABILITY REPORT 98-08, Tony Rubalcava, May 1998, 9 pages.
This report summarizes qualification test results obtained on a product manufactured with the G16 process
(TQTRx) from the Dawson Creek Facility (FAB 3). The test vehicle used in this G16 process assessment
is TriQuint’s TQ9147 standard product encapsulated in a SOIC16 plastic package with thermal tab.
G16 Low Power Device Qualification Report for Fab 3
RELIABILITY REPORT 98-07, Tony Rubalcava, May 1998, 11 pages.
This report summarizes qualification test results obtained on a product manufactured with the G16 process
(TQTRx) from the Dawson Creek Facility (FAB 3). The test vehicle used in this G16 process assessment
is TriQuint’s TQ9203B product encapsulated in a SOIC14 plastic package. Two assembly subcontractors
were evaluated.
G2 Device Qualification Report for Fab 3
RELIABILITY REPORT 98-02, Tony Rubalcava, March 1998, 10 pages.
This report summarizes qualification test results obtained on a standard product manufactured with the
G2 process (QED/A) from the Dawson Creek Facility (FAB 3). The test vehicle used in this G2 process
assessment is TriQuint’s TQ9203 standard product encapsulated in a SOIC14 plastic package. QEDA.
G14 Element Qualification Report
FAB 3 QUALIFICATION REPORT, Lita O. Monaghan, March 1998, 8 pages.
Condensed summary of wafer tests performed on TriQuint’s G14 (TQHiP) Process. Data on three lots of
material from Fab 3 in Hillsboro is presented. Air Bake, Autoclave, and Temperature Cycle stresses
performed on PCM structures.
G2 Element Qualification Report
FAB 3 QUALIFICATION REPORT, Susan Bumgarner, January 1998, 7 pages.
Condensed summary of wafer tests performed on TriQuint’s G2 (QED/A) Process. Data on one lot of material
from Fab 2 in Beaverton and three lots from Fab 3 in Hillsboro. Air Bake, Autoclave, and Temperature
Cycle stresses performed on six types of structures. QEDA.
G16 Element Qualification Report
FAB 3 QUALIFICATION REPORT, Susan Bumgarner, January 1998, 7 pages.
Condensed summary of wafer tests performed on TriQuint’s G16 (TQTRx) Process. Data on one lot of material
from Fab 2 in Beaverton and three lots from Fab 3 in Hillsboro. Air Bake, Autoclave, and Temperature
Cycle stresses performed on six types of structures.
G7 Element Qualification Report
FAB 3 QUALIFICATION REPORT, Susan Bumgarner, January 1998, 9 pages.
Condensed summary of wafer tests performed on TriQuint’s G7 (QED/A 2) Process. Data on two lots of
material from Fab 2 in Beaverton and three lots from Fab 3 in Hillsboro. Air Bake, Autoclave, and
Temperature Cycle stresses performed on six types of structures.
TQ8062, Preliminary Reliability Assessment Report on G7A
RELIABILITY REPORT 97-04, Jeff Kessenich, October 1997, 4 pages.
This report summarizes reliability assessment test results obtained on TriQuint’s G7A GaAs wafer
process fabricated at TriQuint’s Beaverton, Oregon Fab. The test product used to evaluate the
fabrication process is a TQ8062, 2.5 Gb/s 16 Bit Demultiplexer. The product was packaged in a
52 lead EDQUAD plastic quad flatpack package. QEDA2.
|
