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Product Qualification SC102X
RELIABILITY REPORT 02-05. Dee Byrd, March 6, 2002, 6 pages.

This report summarizes the reliability testing that has been completed to qualify TriQuint's SC-102X Gain Block product. The SC102X is fabricated using TriQuint's 0.6um E/D MesFET GaAs TQTRx process and is packaged in a 3mm X 3mm MLF16/LPC at Supplier A1.

TQ130X Device Family Qualification
RELIABILITY REPORT 02-04. Dee Byrd, February 28, 2002, 7 pages.

This report summarizes the reliability testing that has been completed to qualify the TQ-120X family of passive couplers products and the TQ-130X family of passive splitter products. The TQ120X coupler products are a subset of the TQ-130X splitter products. The TQ-120X and TQ-130X products are fabricated on TriQuint's TQRLC Process and are packaged in a 2X2 MLG5/LPCC5 package. B39, 2x2 MLF, 6", 150mm.

Product Qualification TQ8726
RELIABILITY REPORT 01-19. Dee Byrd, November 12, 2001, 6 pages.

The TQ-8726 is a 1:8 DeMux product fabricated on TriQuint's TQHiF advanced Gallium Arsenide (GaAs) 0.3 micron enhancement/depletion mode MesFET process and is packaged in a TSSOP28 package. Assembly and encapsulation of the test samples were accomplished at supplier A1. 100mm.

Product Qualification TQ3M31
RELIABILITY REPORT 01-10. Dee Byrd, August 24, 2001, 8 pages.

The product being qualified (TQ3M31) is a new IC design using a new non-qualified package from an existing qualified subcontractor. This report is intended to provide qualification data for the 3X3 MLF/LPCC packaging process from subcontractor A1 and the TQ3M31 Product. 100mm TQTRx.

Product Qualification TQ8710 (supplier A)
RELIABILITY REPORT 01-09. Dee Byrd, August 14, 2001, 6 pages.

The TQ-8710 is a Driver/Buffer fabricated on TriQuint's QEDA2 0.6um E/D MesFET GaAs process and is packaged in a TSSOP28 package. Assembly and encapsulation of the test samples were accomplished at supplier A.

Product Qualification TQ8710 (supplier M)
RELIABILITY REPORT 01-07. Dee Byrd, May 2, 2001, 7 pages.

The TQ-8710 is a Driver/Buffer fabricated on TriQuint's QEDA2 0.6um E/D MesFET GaAs process and is packaged in a TSSOP28 package. Assembly and encapsulation of the test samples were accomplished at supplier M.

TriQuint Texas HBT Process Qualification
RELIABILITY REPORT 01-06. Dee Byrd, April 30, 2001, 7 pages.

This report summarizes the product reliability testing that was completed on the HBT process produced by TriQuint Texas. The product test vehicle used during the qualification was the 7M51, which is an RF Driver Amplifier packaged in a SOT23-6 package.

Product Qualification TQ8004
RELIABILITY REPORT 01-05. Dee Byrd, April 13, 2001, 8 pages.

The TQ-8004 4x4 Cross Point is fabricated on TriQuint's QEDA2 0.6u E/D MesFET GaAs process (QEDA2) and is packaged in a TSSOP28 package. Assembly and encapsulation of the test samples were accomplished at supplier A.

TQ8224 Device Qualification
RELIABILITY REPORT 01-02. Dee Byrd, January 30, 2001, 6 pages.

TQ8224 qualification report based on its similarity to two (2) other products which were previously qualified, the SC5068 and the TQ8033. The functionality, core circuitry, die size, and package type of the SC5068 is identical to that of the TQ8224. The TQ8224 has PECL/ECL input - output circuitry while the SC5068 has TTL input - output circuitry. QEDA2 (G7).

TQ8214 Device Qualification
RELIABILITY REPORT 01-01. Dee Byrd, January 20, 2001, 6 pages.

The TQ8214 multiplexer qualification report based on its similarity to two (2) other products which were previously qualified, the TQ8213 and the TQ8033. QEDA2 (G7).

TQ8223 Device Qualification
RELIABILITY REPORT 00-08. Dee Byrd, August 1, 2000, 5 pages.

This report summarizes the reliability testing that has been performed to qualify the TQ8223 product. The SC5068 is a Superset of the TQ8223 and was previously qualified. The TQ8213, which is also packaged in a 208 BGA, was used as an additional lot for dimensional qualification. QEDA2.

TQ8213 Device Qualification
RELIABILITY REPORT 00-07. Dee Byrd, July 26, 2000, 7 pages.

The TQ8213 is fabricated on TriQuint's 0.6um E/D MesFET GaAs and is packaged in a 208 BGA package. Assembly and encapsulation of the test samples were performed at supplier U. QEDA2.

SC5068 Device Qualification
RELIABILITY REPORT 00-06. Dee Byrd, July 20, 2000, 8 pages.

The SC5068 is a variant of the TQ8223. The SC5068 is fabricated on TriQuint's 0.6um E/D MesFET GaAs process and is packaged in a 208 BGA package. QEDA2.

TQ3131 Device Qualification
RELIABILITY REPORT 00-04. Dee Byrd, May 1, 2000, 7 pages.

The TQ3131 is fabricated on TriQuint's 0.6um E/D MesFET GaAs and is packaged in a SOT-23-8 package. Assembly and encapsulation of the test samples were accomplished at supplier U. TQTRx.

TQ8033 Device Qualification
RELIABILITY REPORT 99-05. Dee Byrd, August 31, 1999, 7 pages.

This report summarizes the testing that was done on the TQ-8033 to qualify it per the requirements of REL.021. This report also functions as the qualification for the 304 BGA fabricated by subcontractor A and the qualification of QEDA2 for large die. (G7)

TQ5M31 Device Qualification HTOL
RELIABILITY REPORT 99-04. Dee Byrd, May 10, 1999, 4 pages.

This report summarizes the reliability testing that was completed to verify that the TQ5M31 has a failure rate of less than 100 FITs when subjected to high temperature operating life test. Using the Arrhenius Calculations, assuming a 60% confidence level the test results indicate a FIT Rate = 3.45 fits. TQTRx.

TQ8032 ESD Evaluation Report
RELIABILITY REPORT 99-01. Dee Byrd, February 8, 1999, 6 pages.

This report describes an ESD evaluation performed at TriQuint Semiconductor using the TQ8032. The purpose of the evaluation is to classify the device design in terms of it sensitivity to an ESD event simulated by the Human Body Model. Classification is intended to provide information as to the relative susceptibility of a circuit. QEDA2.

TQ9222 Device Qualification
RELIABILITY REPORT 98-011. Dee Byrd, October 4, 1998, 8 pages.

This report summarizes the initial reliability testing that has been completed to qualify the TQ-9222 product on lot 4483. TQTRx.

G7 RF Device, SC-4402-A, Reliability Qualification Report
RELIABILITY REPORT 98-06, Bill Roesch, August 1998, 8 pages.

This report summarizes qualification test results obtained on a lead product from TriQuint’s G7 process. The SC-4402-A is a custom Foundry product encapsulated in a SOIC-8 plastic package. Assembly and encapsulation of the test samples were taken from 3 lots packaged at two separate sub-contract assembly locations. Tests performed were HTOL, HAST, Autoclave, Temperature Cycle and Thermal Shock. QEDA2.

SC-2682-DM Fab 3 Reliability Qualification Report
RELIABILITY REPORT 98-01, Jeff Kessenich, March 1998, 5 pages.

This report summarizes qualification test results obtained on the SC-2682-DM Decoder and High Speed Demultiplexer fabricated in TriQuint’s Fab 3 in Hillsboro, Oregon. This qualification was intended to evaluate the reliability differences between the original SC-2682-DM qualification on material fabricated in Fab 2 and material fabricated in Fab 3. No changes have been made to the design, package, or test. The SC-2682-DM is fabricated on TriQuint’s 1.0um E/D MesFET GaAs process and is packaged in a MLC84/40 package. This report includes results from Biased Lifetesting, Temperature Cycling, Wire Bond Pull Strength, and ESD Sensitivity tests. QEDA.

SC-4344-AS, ASIC Mixer, Device Reliability Qualification Report
RELIABILITY REPORT 98-05, Rob Gwynn, March 1998, 9 pages.

This report summarizes qualification test results obtained on TriQuint’s SC-4344-AS custom Foundry product encapsulated in a SOT23-6 (SOT26) plastic package. Assembly and encapsulation of the test samples were accomplished at supplier L. Tests performed were HTOL, HAST, Autoclave, Temperature Cycle, Thermal Shock, ESD Threshold, Solderability, Resistance to Solvents, Lead Integrity and Conformance to Physical Dimensions. Material from Fab 2 and Fab 3 was evaluated.

TQ9223 Qualification Test Report
RELIABILITY REPORT 98-04, Tony Rubalcava, March 1998, 5 pages.

This report summarizes qualification test results obtained on a standard product manufactured with the G2 process (QED/A) from the Beaverton, Oregon facility (FAB 2). TriQuint’s TQ9223 standard product encapsulated in a SOIC14 plastic package was assembled and encapsulated by supplier H. The test performed on the TQ9223 was ESD, Lifetest, Temperature Cycle, Thermal Shock and Resistance to Soldering Assembly Heat. All these tests were completed in June of 1996. QEDA.

SC-3428-AZ, Reliability Test Report
RELIABILITY REPORT 97-02, Tony Rubalcava, February 1997, 5 pages.

This report summarizes qualification test results obtained on SC-3428-AZ ASIC product. The SC-3428-AZ is encapsulated in a QSOP 16 plastic package. Assembly and encapsulation of the test samples were accomplished at Subcontractor A. Tests were defined by the customer. Most tests in this report follow the JEDEC Standard Number 26-A or MIL-STD-883 when applicable. Exception to the standards was the requirement of testing devices within 48 hours of the stress. Tests performed were Temperature Cycle, Biased 85ºC/85% Humidity Lifetest and Autoclave."

TQ9142 Reliability Qualification Report
RELIABILITY REPORT 97-01, Tony Rubalcava, January 1997, 12 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ9142 standard product encapsulated in a SOIC16 batwing plastic package. Assembly and encapsulation of the test samples were accomplished at supplier H. Tests performed were Thermal Analysis, ESD Threshold, HTOL, Temperature Cycle, Resistance to Soldering/Assembly Heat and the JEDEC package qualification tests.

TQ8103 Reliability Qualification Report
RELIABILITY REPORT 96-07, Jeff Kessenich, December 1996, 5 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ8103 Clock and Data Recovery integrated circuit. The TQ8103 is fabricated on TriQuint’s 0.7um E/D MesFET GaAs process and is packaged in a 28 pin MQuad package. This report includes results from Biased Lifetesting, Temperature Cycling, Temperature Humidity Biased (85/85) testing, and ESD Sensitivity tests. The package and process are qualified by extension from reliability tests on previous products. All testing was satisfactorily completed and the TQ8103 is considered to be suitable for reliable operation in commercial environments.

TQ9501 & TQ9502 Reliability Qualification Report
RELIABILITY REPORT 96-04, Jeff Kessenich, November 1996, 5 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ9501 and TQ9502 integrated circuits. The TQ9501 & TQ9502 are fabricated with TriQuint’s 0.7?m E/D MesFET GaAs process and are packaged in a 44 pin MQuad package. This report includes die qualification test results from Biased Lifetesting, Temperature Cycling, and ESD Sensitivity tests.

SC-3037-AM Reliability Qualification Report
RELIABILITY REPORT 96-05, Jeff Kessenich, July 1996, 5 pages.

This report summarizes reliability qualification test results obtained on the SC-3037-AM ASIC. The SC-3037-AM is fabricated with TriQuint’s 0.7?m E/D MesFET GaAs process and is packaged in a 132/96 MLC package. This report includes die qualification test results from Biased Lifetesting, Temperature Cycling, High Temperature Bake, RGA, and ESD Sensitivity tests.

SC-3038-AM Reliability Qualification Report
RELIABILITY REPORT 96-06, Jeff Kessenich, July 1996, 5 pages.

This report summarizes reliability qualification test results obtained on the SC-3038-AM ASIC. The SC-3038-AM is fabricated with TriQuint’s 0.7um E/D MesFET GaAs process and is packaged in a 132/96 MLC package. This report includes die qualification test results from Biased Lifetesting, Temperature Cycling, High Temperature Bake, RGA, and ESD Sensitivity tests.

TQ8101C Reliability Qualification Report
RELIABILITY REPORT 96-01, Jeff Kessenich, April 1996, 4 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ8101C SONET/SDH transceiver integrated circuit fabricated on TriQuint’s 0.7um E/D MesFET GaAs process and packaged in a 68 pin MLC package. This report includes results from Biased Lifetesting, Temperature Cycling, and ESD Sensitivity Tests.

SC-2814-AM Reliability Qualification Report
RELIABILITY REPORT 96-03, Jeff Kessenich, March 1996, 5 pages.

This report summarizes qualification test results obtained on the SC-2814-AM High Speed Multiplexer. The SC-2814-AM is fabricated on TriQuint’s 0.7um E/D MesFET GaAs process and is packaged in a MLC84/40 package. This report includes results from Biased Lifetesting, Temperature Cycling, RGA, High Temperature Storage, and ESD Sensitivity tests.

SC-2682-AM Reliability Qualification Report
RELIABILITY REPORT 96-02, Jeff Kessenich, March 1996, 5 pages.

This report summarizes qualification test results obtained on the SC-2682-DM Decoder and High Speed Demultiplexer. This qualification was intended to evaluate both the IC and package reliability. The SC-2682-DM is fabricated on TriQuint’s 0.7um E/D MesFET GaAs process and is packaged in a MLC84/40 package. This report includes results from Biased Lifetesting, Temperature Cycling, RGA, Leak Testing, High Temperature Storage, Lead Pull Force, Wire Bond Pull Strength, Die Shear Strength, Mechanical Vibration, Mechanical Shock, Thermal Shock, Acceleration, Internal/External Visual, and ESD Sensitivity tests.

TQ9205 Reliability Device Qualification Report
RELIABILITY REPORT 95-03, Tony Rubalcava, October 1995, 8 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ9205 standard product encapsulated in a SSOP-24 plastic package. Testing has been performed as defined in TriQuint’s specification REL.021. Most package-related tests in this qualification follow JEDEC Standard No.26-A, or MIL-STD-883 when applicable. Tests performed were: Thermal Analysis, ESD Threshold, Voltage Ramp, Temperature Ramp, High Temperature Operating Life, Temperature Cycle, and Resistance to Soldering/Assembly Heat.

TQ9203 Reliability Device Qualification Report
RELIABILITY REPORT 95-02, Tony Rubalcava, June 1995, 8 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ9203 standard product encapsulated in a SOIC-14 plastic package. Testing has been performed as defined in TriQuint’s specification REL.021. Most package-related tests in this qualification follow JEDEC Standard No.26-A, or MIL-STD-883 when applicable. Tests performed were: Thermal Analysis, ESD Threshold, Voltage Ramp, Temperature Ramp, High Temperature Operating Life, Temperature Cycle, and Resistance to Soldering/Assembly Heat.

TQ9132 Reliability Device Qualification Report
RELIABILITY REPORT 95-01, Tony Rubalcava, June 1995, 7 pages.

This report summarizes qualification test results obtained on TriQuint’s TQ9132 standard product encapsulated in a SOIC-8 plastic package. Testing has been performed as defined in TriQuint’s specification REL.021. Most package-related tests in this qualification follow JEDEC Standard No.26-A, or MIL-STD-883 when applicable. Tests performed were: Thermal Analysis, ESD Threshold, Voltage Ramp, Temperature Ramp, High Temperature Operating Life, Temperature Cycle, and Resistance to Soldering/Assembly Heat. HA2.

GA1088 ESD Evaluation Report (request a copy)
RELIABILITY REPORT 94-02, Bill Roesch, May 1994, 11 pages.

This report describes a standard ESD evaluation to classify the device design in terms of its sensitivity to an ESD event simulated by the Human Body Model. A strict failure criterion of "first parametric change" is applied. All devices were found to withstand simulated ESD pulses greater than 1,800 Volts, with most devices surviving 2,000 Volt zaps.

GA901X (Hot Rod) ESD Evaluation Report (request a copy)
RELIABILITY REPORT 94-01, Bill Roesch, January 1994, 9 pages.

This report describes a standard device ESD classification by using the Human Body Model. The intent of this test is to give the end user the best indication of the safe operating region for this device family.

GA1110E Reliability Qualification Report (request a copy)
RELIABILITY REPORT 92-01, Ross Winters, July 1992, 9 pages.

This publication summarizes TriQuint's first qualification test results obtained on a standard product family. The testing includes thermal analysis, ESD sensitivity, lifetesting, and temperature cycling on a clock distribution chip.