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Printable Version Printable Version




150-mm Process Summary

  Units TQTRx TQHiP TQHBT3 TQPED TQRLC
Release Status   Production Production Production Production Production
Transistor Type   1 E-Mode
1 D-Mode
1 D-Mode 1 BiP 1 E-Mode
2 D-Mode
(None)
E-FET Vth V (E) +0.15     +0.35 N/A
D-FET Vp V (D, D2) -0.6,-2.2 -2.2   -0.8 N/A
HBT Vbe       +1.15    
Gate Length µm 0.6 0.5   0.5 N/A
HBT Emitter µm     3 x 30   N/A
Drain Current, sat mA/mm
(E,D,D2)
80,70,270
(365 Imax)
250
(335 Imax)
N/A 225
(310 Imax)
N/A
Ft GHz 20 16.5
(50% Idss)
40 25,30 N/A
Gm or Beta mS/mm
(E,D,D2)
225,200,270 140 130 350,625 N/A
Nom. Breakdown V 12,12,15
(E,D,D2)
18
(14 min)
24,7,14
(cbo,beo,ceo)
15,15
(E,D)
N/A
Interconnect Total Layers 3 3 3 3 4
MIM Caps pf/mm2 1200 600 1200,600 600 600
NiCr Resistors Ohms/sq 50 50 50 50 50
Bulk Resistors Ohms/sq 600 600 350 285 (None)


100-mm Process Summary

  Units .5-µm
HFET
Size µm, # fingers 300, 4
VDD/IDS V, mA 8, 22.5
Freq GHz 2 10 18
NF Min dB 0.8 2.2 3.3
MSG, MAG dB 20.8 13.8 10.4
PAE %   >70 65 50
POUT W/mm 0.60
Ft GHz 19C
fMAX GHz 57D
IDSS mA/mm 245
Gm mS/mm 165
VBD V -22
VP V -1.8

  Units .25-µm
MMW pHEMT
Size µm, # fingers 400, 8 600, 10
VDD/IDS V, mA 2, 20 6, 90
Freq GHz 10 18 26 10 18 26
NF Min dB 0.6 1.1 1.6  
MSG, MAG dB 14.9 12.6 11.4 17.5 15.4 11.3
PAE %   60 50 40 65 55 45
POUT W/mm 0.10 0.60
Ft GHz 55 55
fMAX GHz 75D 75D
IDSS mA/mm 285 285
Gm mS/mm 375B 375B
VBD V -21 -21
VP V -1 -1

Notes:

A. IMAX

B. GM(MAX)

C. |h21| = 0

D. GMAX = 0



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