Many TriQuint SAW product customers request solder profile information for soldering either surface mount or through hole packages to their PC boards. Since there are many different methods and equipment types used in the soldering process, the following information, shown below in Figure 1 and Table 1, should be utilized as a recommended guideline only.

Figure 1. Typical Solder Reflow Profile

Specification Description Solder Type (Paste or Preforms) Tin/Lead with composition of %Sn as: 60, 62, 63 per QQ-S-571; Lead free with composition of %Sn as: 95, 96.5 per QQ-S-571 Flux Classified in accordance with IPC-SF-818 or equivalent Handling (ESD) Class I per MIL-STD-1686 Presolder Storage Non-contaminating environment with a maximum temperature of 77 oF (25oC), and a maximum humidity of 50% Hole Size* The inside diameter of the circuit board hole should be between .010 and .020 inches of the device lead diameter Annular Ring* The circuit board annular ring (pad) should be separated from the device metal area around a glassed-in lead by a minimum of .005 inches Equipment Must meet ESD requirements defined by MIL-STD-1686 Preheating Preheat device to 160 - 240 oF (71 - 116oC) * Through hole only

Table 1. Recommendations for Soldering SAW Devices